|
|
|
SERIAL |
ITEM |
TECHNICAL DATA |
|
1 |
Layers |
1-22 Layers |
|
2 |
Base-material |
XPC¡¢FR-2¡¢CEM-1¡¢CEM-3¡¢FR-4¡¢ Aluminium base
|
|
3 |
Board thickness |
16~126 mil (0.4~3.2 mm) |
|
4 |
Copper foil |
1/2oz,1oz,2oz,3oz |
|
5 |
Working panel size |
12¡å* 13¡å~ 21¡å* 24¡å |
|
6 |
Min. drill size (finished) |
8mil (0.2mm) |
|
7 |
Hole diameter tolerance |
PTH: ¡À3mil, NPTH: ¡À2mil |
|
8 |
Hole location tolerance |
¡À 2mil |
|
9 |
PTH Wall Thickness |
0.020mm |
|
10 |
Aspect ratio |
10/1. |
|
11 |
Line width/space |
4/4mil |
|
12 |
Line width/space tolerance |
¡À 20% |
|
13 |
Via plug |
Max via size : 24mil (0.6mm) |
|
15 |
S/M Pitch |
Min.: 2 mil (0.05 mm) |
|
16 |
HAL |
40u"-1000u" |
|
17 |
OSP |
100A ¡ã ~ 400A ¡ã |
|
18 |
Gold finger (Max.) |
Ni : 80~250 u", Au : 1~50 u" |
|
19 |
EN/IG (Max.) |
Ni : 80~200 u", Au : 1~8 u" |
|
20 |
Warp and Twist |
¡Ü 0.75 % |
|
21 |
Outline Tolerance |
¡À 6 mil (0.15 mm) |
|
22 |
Impedance tolerance |
¡À 10 % |
|
23 |
Insulation Resistance |
1E+12¦¸ £¨ Normal £© |
|
24 |
Solder Mask Abrasion |
¡Ý 6H |
|
25 |
Electric Strength |
£¾ 1.3KV/mm |
|
26 |
Peel Strength |
1.4N/mm |
|
27 |
Thermal Shock |
3x10Sec@ 288 ¡æ
| | |
